Engineer, Materials: review IC packaging reqts to eval materials reqts/qual for fluxless chemical bonding of Si/SiC chips to substrate, eg copper, aluminum, iron, low carbon steel, surface finish, treatment for electronic packaging & intermetallics; manage new devices phase in material quality; execute materials/process engrg activities. Wk site in Tempe, AZ; mail resume to: Siliconware USA Inc., 1007 E. Warner Rd., #101 Tempe, AZ85284.The Arizona Republic. Keywords: Materials Engineer, Location: Tempe, AZ - 85284 Associated topics: alloys, ceramic, glass, material, material engineer, metallurgical, plastics, polymer, polyurethane, welding
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